A comprehensive guide to 3D MEMS packaging methods and solutions        Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenges created by the ever-increasing interest in MEMS devices and packaging.  This authoritative guide presents cutting-edge MEMS (microelectromechanical systems) packaging techniques, such as low-temperature C2W and W2W bonding and 3D packaging.        This definitive resource helps you select reliable, creative, high-performance, robust, and cost-effective packaging techniques for MEMS devices.  The book will also aid in stimulating further research and development in electrical, optical, mechanical, and thermal designs as well as materials, processes, manufacturing, testing, and reliability.  Among the topics explored:    Advanced IC and MEMS packaging trends    MEMS devices, commercial applications, and markets    More than 360 MEMS packaging patents and 10 3D MEMS packaging designs    TSV for 3D MEMS packaging    MEMS wafer thinning, dicing, and handling    Low-temperature C2C, C2W, and W2W bonding    Reliability of RoHS-compliant MEMS packaging    Micromachining and water bonding techniques    Actuation mechanisms and integrated micromachining    Bubble switch, optical switch, and VOA MEMS packaging    Bolometer and accelerameter MEMS packaging    Bio-MEMS and biosensor MEMS packaging    RF MEMS switches, tunable circuits, and packaging

Advanced MEMS Packaging (Electronic Engineering) PDF

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